High Production with Exacting Temperature and Atmosphere Control
We manufacture the fastest and most efficient production furnaces available for thick film processing. High production yields and throughput are achievable due to the design’s quick start-up and changeover time, precise and repeatable temperature profiles up to
1000 degrees *C*.
The process gas atmosphere is uniform and ultra-clean.
The TFP-Series infrared furnaces achieve exacting temperature profiles with rapid heat rise and no overshoot. The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semiconductor is not exposed to prolonged high temperature. The systems require only minutes to come up to temperature and stabilize.
Motorized Chamber Lift. TF-Series furnaces include our unique motorized chamber lift.
This feature allows users to open the furnace chamber, separating the chamber top and bottom for inspection, cleaning and maintenance of chamber internals.
This furnace is operated via the lasted Furnace control software installed on a robust managed platform industrial furnace computer. The process engineer can easily vary process parameters using the sophisticated PID and power control parameters in the software. An almost infinite number of recipes and profiles can be labeled and stored for ready access on the furnace computer. The software includes multiple levels of password protected control and logs each change in recipe load or furnace state useful for troubleshooting product and process performance.
The furnace software operates on a Microsoft Windows 7 Professional computer system.
The program and all settings and recipes are stored on the local hard drives.
The computer is complete with 19″ LCD 1280×1024 high resolution color graphic screen,
full size keyboard/mouse interface and Ethernet high-speed network connections
to facilitate view and control of the furnace by managers and process engineers
from any location.
The furnace includes two (2) local USB ports for connecting profilers
and jump drive storage devices.
Low cost of ownership results from the furnace versatility, high throughput, quick readiness, and low utility consumption. Small zones and high temperature differentials enable broad profile flexibility. Profiles with peak temperatures from 150 degrees *C* to
1000 degrees *C* are possible.
The furnace can be turned on, turned off,
or re-profiled in minutes, saving time and money.
for Typical S-Series Models
|Control Zones||6 zones||6-12 zones||8-12 zones||10-12 zones||16 zones|
|Heating Chamber length||152 cm |
|267 cm 105 inches||304 cm 120|
|Cooling Chamber||152-304 cm (60-120 inches), consisting of a mix of these modules, depending on application:|
|1. CACT – CDA
or N2 convective and radiant cooling,
exterior fan heat removal.
|2. CAWC – CDA or N2 convective and radiant cooling, cold water heat removal (city or chiller).|
|Belt Size (model, width)||TF-609 22.8 cm|
|Exhaust||Improved venturi exhaust stacks to reduce process gas consumption. Number of stacks vary with process requirements.|
|Temperature Capacity, max||1000 degrees *C*|
|Electrical||All models include universal transformers
which accommodate 220-480 Vac 3-ph and 50/60 Hz frequency anywhere in the world,
allowing furnace relocation without external equipment.
|All furnace systems are phase balanced to improve facility efficiency.|
|IR lamp controls automatically keep IR spectrum constant.|
All standard models (except LA-306 series and “P” models) include a RAID1 computer with LCD screen, full size keyboard interface
and both Ethernet and wireless-N high-speed network connections to facilitate view
and control of the furnace by managers and process engineers from any location.
Four (4) local USB ports are provided, convenient for connecting a furnace profiler and jump drive storage devices.
The new “P” series replaces the computer control system with high quality discrete digital controllers
for cost-effective precision control on repetitive production applications.
These furnaces are a good solution in applications where process recipes are changed infrequently and auxiliaries are at a minimum.