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LTCC Consulting Services

LTCC Consulting Services


Technical and Manufacturing Expertise Includes:

  • Plateable Silver Process
  • Enhanced thermal conductivity heat spreaders
  • Multi-Layer Cavities
  • Complex 3-Dimensional Shapes
  • Package on Package (PoP)
  • High frequency substrates and packages operating at frequencies up to 110 GHz.
  • Fully hermetic high reliability packaging
  • Space and flight qualified substrates and packaging.
    • Over 40 years of combined RF and Microwave design experience
    • Over 75 years of combined LTCC substrate and package fabrication experience
      • Low-Temp Co-Fired Ceramic (LTCC) and Thick-film Design
      • Advanced Vertically Integrated Substrate and Package Design
      • RF and Microwave Simulation including Full-wave 3D EM Simulation
      • Filter Design – Lumped, Distributed, Tunable, Embedded) including High Power Filter Design
      • Synthesizer Design including VCO’s, Resonators and PLL’s
      • RF Amplifier Design
      • Receiver and Transceiver Design
      • Diplexer and Transmit / Receive Switching Design and Fabrication experience with multiple commercial material sets
        working with vendor products from: DuPont, Ferro, and Heraeus,
        using various conductor systems such gold, silver, mixed metal,
        and nickel-gold plated silver.
      • Contact Us For More Information


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