Technical and Manufacturing Expertise Includes:

• Plateable Silver Process
• Enhanced thermal conductivity heat spreaders
• Multi-Layer Cavities
• Complex 3-Dimensional Shapes
• Package on Package (PoP)
• High frequency substrates and packages operating at frequencies up to 110 GHz.
• Fully hermetic high reliability packaging
• Space and flight qualified substrates and packaging.
  
• • Over 40 years of combined RF and Microwave design experience
  • Over 75 years of combined LTCC substrate and package fabrication experience
    • Low-Temp Co-Fired Ceramic (LTCC) and Thick-film Design
    • Advanced Vertically Integrated Substrate and Package Design
    • RF and Microwave Simulation including Full-wave 3D EM Simulation
    • Filter Design – Lumped, Distributed, Tunable, Embedded) including High Power Filter Design
    • Synthesizer Design including VCO’s, Resonators and PLL’s
    • RF Amplifier Design
    • Receiver and Transceiver Design
    • Diplexer and Transmit / Receive Switching Design and Fabrication experience with multiple commercial material sets
      working with vendor products from: DuPont, Ferro, and Heraeus,
      using various conductor systems such gold, silver, mixed metal,
      and nickel-gold plated silver.
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