Technical and Manufacturing Expertise Includes:
- Plateable Silver Process
- Enhanced thermal conductivity heat spreaders
- Multi-Layer Cavities
- Complex 3-Dimensional Shapes
- Package on Package (PoP)
- High frequency substrates and packages operating at frequencies up to 110 GHz.
- Fully hermetic high reliability packaging
- Space and flight qualified substrates and packaging.
- Over 40 years of combined RF and Microwave design experience
- Over 75 years of combined LTCC substrate and package fabrication experience
- Low-Temp Co-Fired Ceramic (LTCC) and Thick-film Design
- Advanced Vertically Integrated Substrate and Package Design
- RF and Microwave Simulation including Full-wave 3D EM Simulation
- Filter Design – Lumped, Distributed, Tunable, Embedded) including High Power Filter Design
- Synthesizer Design including VCO’s, Resonators and PLL’s
- RF Amplifier Design
- Receiver and Transceiver Design
- Diplexer and Transmit / Receive Switching Design and Fabrication experience with multiple commercial material sets
working with vendor products from: DuPont, Ferro, and Heraeus,
using various conductor systems such gold, silver, mixed metal,
and nickel-gold plated silver.
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