SMD-FURNACES


IR Dryers or Ovens for drying and/or curing
with infrared energy from 90-400 degrees *C*,
with excellent uniformity across the belt and precise,
repeatable zone temperature control.

D-SERIES CONTINUOUS BELT NEAR INFRARED DRYER
D-SERIES CONTINUOUS BELT NEAR INFRARED DRYER

Choice of 24, 37, 61 or 91 cm wide belts
for increased throughput while maintaining acceptable residence time.
Inch widths called out on spex page.

Ultrasonic belt cleaning and production line
signaling/product transfer options available

Application:

Used for precision thick film drying and baking and curing
of polyimide coatings or embedded components. The

D-Series IR Dryer uniform heating is ideal for
production heat processing applications, surface heating,
drying and curing specialty coatings and finishing operations.
An available closed atmosphere option
allows thermal processing without oxidation.

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LA-SERIES IR LAB FURNACE
LA-SERIES IR LAB FURNACE

LA-Series:

LA-306 Updated!
LA-306N
LA-309
LA-309P

SS Load station, 38 cm (15″) L

Full 38 cm (15″) L Entrance Baffle

SS Heating Chamber, 76 cm (30″) L

Full 38 cm (15″) L Transition Baffle

CACT cooling, 76 cm (30″) L

SS Unload station, 38 cm (15″) L

Process gasses may be CDA, nitrogen or forming gas
(up to 5% hydrogen).

Many performance and ease of use options are available.

LA-306:
  3-Zone, 15 cm, (6-inch) belt
Single phase 1000 degrees *C* IR furnace
for tight temperature control in a tiny footprint for production and lab.

The ever-popular LA-306 models include
our latest Discrete Digital Control system
with our new closed-loop belt speed control.

LA-309P:  3-Zone
24 cm  (9.5-inch) belt provides large furnace processing power
in a high-quality cost-effective compact furnace.

The LA-309P features the standard LA-309 furnace internals
installed in an expanded LA-306 frame.

Like the LA-306, the LA-309P
uses our latest Discrete Digital Control system
with closed-loop belt speed control.

LA-309: 3 to 4-Zone  24 cm  (9.5″) belt

The LA-309 furnace is a powerful and versatile
3- or 4-zone computer-controlled furnace.

LA-309 and LA-309P both include
a transition tunnel exhaust stack for balancing process gas flow.


Applications:

LA-Series Furnaces are used for experimental,
prototype or low volume processing
and specialty production applications
where rapid heat rise in a controlled process atmosphere
in a small footprint is of particular interest.

Its flexibility, process precision, temperature range,
and controlled atmosphere capabilities
are similar to many of our larger models.
Clean air compatible to Class 1000,
the LA-309 can process substrates, wafers, PCBs, metal, ceramic, or glass parts
for VOC burnout, thick film firing –
including solar cell firing, semiconductor package sealing: solder lid seal, glass seal,
low oxygen solder seal (<20ppmv),
glass seal, epoxy die attach, polymer curing,
reflow soldering, and precious metals and alloy brazing and annealing.

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SMD Series:

SMD-Series infrared furnaces for higher production yield and
throughput and feature start-up often in less than 30 minutes
for temperature profiles up to 1000 degrees *C*.

Tested against conventional furnace technology,
the SMD-series furnaces offer faster setup and stabilization time;
repeatable profiles; no degrade of seal process;
lower internal cavity moisture content
and comparable hermetic performance; lowest ppm defect rates;
and superior temperature uniformity.

Also 90% belt edge conveyor load efficiency.
Inert atmosphere for fine pitch solder pastes.
Diffuse near and medium IR heating efficiency
without color selectivity.

Applications: 

SMD Series is an Electronic industry
semiconductor packaging, frame attach,
die attach and sealing application tool.

Choose Air for low cost;
Nitrogen (max 500 ppm oxygen) reduces board
browning and flux charring for easier cleaning; or Nitrogen
(max 5 ppm Oxygen) for 40-60% faster processing speeds,
lower defect rates, and improved secondary soldering yields,
ideal for high volume critical applications.

Also used for ceramic and glass epoxy applications
and a variety of production processes
including curing polymer thick film materials
or epoxy potting compounds.

Nomenclature and legend inks
Conformal Coatings,
Bonding epoxies or encapsulating epoxies on IC’s
Process heat shrink tubing
Bake photoresist on silicon wafers
Drying thick film pastes.

Designed for 280-1000 degrees *C*
volume production of noble metal thick film products,
metal, ceramic and glass inks screen-printed
on a variety of substrates for production of surface mount devices,
hybrid integrated circuits and sensors including
semiconductor package sealing:
solder lid seal, glass seal, low oxygen solder seal (<20ppmv),
glass seal, epoxy die attach and other electronic devices.

The energy-rich, radiant environment allows all thick film materials
to be processed very rapidly.

Resistors are processed at total profile times of 12-15 minutes
while conductors and dielectrics can be fired in as little as 10 minutes.

This environment affords tighter distribution of process parts
and also gives the processor the ability to cofire multilayers up to 300mm thick.

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TFP Series:

Thick Film Dedicated IR Process Furnace
Thick Film Dedicated IR Process Furnace

Updated with new DDC control system.

Fast efficient thick film production infrared furnaces.
Capable of 1000 degrees *C* these units utilize high level
near infrared radiation to rapidly and accurately fire resistors,
conductors and dielectrics in a controlled clean, dry atmosphere.

The furnaces are designed
to cycle on a daily or more frequent basis.

They will stabilize at
1000 degrees *C* from a cold start
in under 20 minutes.

Major profile changes can be accomplished in minutes,
allowing the furnace to be regularly used
for a variety of processes.

Production rates of up to 23,000 square inches per hour (16 ipm)

can be achieved, with still higher rates for some conductors and dielectrics.

Application: 

TFP Series is designed for: 280-1000 degrees *C*
volume production of noble metal thick film products,
metal, ceramic and glass inks screen-printed on a variety of substrates
for production of surface mount devices, hybrid integrated circuits
and sensors including semiconductor package sealing:
solder lid seal, glass seal, low oxygen solder seal (<20ppmv), glass seal,
epoxy die attach and other electronic devices.

The energy-rich, radiant environment allows all thick film materials
to be processed very rapidly.

Resistors are processed at total profile times of 12-15 minutes
while conductors and dielectrics can be fired in as little as 10 minutes.

This environment affords tighter distribution of process parts
and also gives the processor the ability to cofire multilayers up to 300mm thick.

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S-Series
Seal Production Furnaces

S-Series Furnaces - IR SEALING FURNACE

These are Fast efficient production infrared furnaces,
This  S-Series Infrared Furnace offer high production yield,
throughput and feature start-up often in less than 30 minutes,
precise and repeatable zone temperature control,
temperature profiles up to 1000 degrees *C*
and controlled-atmosphere capability of 1-5 ppm above incoming gas purity.

The S-Series Infrared Furnaces utilize high intensity heat
to achieve exacting temperature profiles,
with rapid heat rise and no overshoot.

Two to 12-Zone systems available.

Hydrogen capabilities too!

Applications:

S-Series Infrared Furnaces


These tools are ideal for many high-temperature semiconductor and thick-film processing.
The rapid heat rise of these furnaces is of particular advantage
in the final lid sealing or die attach process
since the semiconductor is not exposed to prolonged high temperature.

In lead frame attachment, there is no contact with the part to cause distortion in the frame.
All leads remain planar which greatly facilitates
subsequent automatic wire bonding steps.

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AG-Series Infrared Furnace

Temperatures up to 1000 degrees *C*, multistage
temperature profiles, rapid removal of volatiles
with multiple intermediate exhausts, inline drying and firing,
multiple atmospheres with gas barriers, clean room compatible.

Two to 12-Zone systems available.

Applications:  AG-Series

Silver-glass die attach,
CERDIP and similar processes requiring multi-stage temperature profiles
and rapid removal of volatiles.

These capabilities are facilitated by the use of multiple intermediate exhaust stacks.

Ideal for single and two stage silver-glass die attach profiles,
as well as solar-cell and green tape drying and firing sequences.

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SC-Series Furnaces


These tools offer high production yield and throughput, feature
start-up often in less than 30 minutes, precise
and repeatable zone temperature control, temperature profiles up to 1000 degrees *C*
and controlled-atmosphere capability of
1-5 ppm above incoming gas purity.

SCD-IR-FURNACE
SCD-IR-FURNACE

Fast efficient production infrared furnace

The SC-Series Solar Cell furnace
can be combined with an integral dryer in the
SCD-Series Solar Cell system!

Applications:

SC-SCD w/dryer Series Furnace

High-temperature photovoltaic applications.

The rapid heat rise of these furnaces is of particular advantage
in the final  process.

Order with a dryer as an option and you have an SCD Series Furnace!

All standard models (except LA-306 series and “P” models) include a RAID1 computer
with LCD  screen, full size keyboard interface
and both Ethernet and wireless-N high-speed network connections to facilitate view
and control of the furnace by managers and process engineers from any location.
Four (4) local USB ports are provided, convenient for connecting a furnace profiler and jump drive storage devices.

 The new “P” series replaces the computer control system with high quality discrete digital controllers
for cost-effective precision control on repetitive production applications.
These furnaces are a good solution in applications where process recipes are changed infrequently and auxiliaries are at a minimum.