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karenmadison.com
NEW
Thermal
Processing
Equipment
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HXF Series
Hot Air Circulating Box Oven
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Applications:
Welding and drying of semiconductor and
precision component
in
N2
atmosphere, de-binding of ceramic, curing of organic
material,
special drying etc. |
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Features:
Hot-air circulation, parallel flow, high
heat efficiency,
uniform temperature; energy saving.
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Operating Temperature:RT-150/350/550/750℃ |
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Options: Programmable
temperature control, forced cooling system,
temperature recording, computer monitoring
system, cleanness design, atmosphere protection
system, binder burning out system
and double door design. |
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Note:
HENGLI also manufactures custom designed
furnaces. |
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Model |
Chamber Dimension
mm/in |
Atmosphere |
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HXF006-07 |
400/16" x
400/16" x 350/14" |
Air/Nitrogen |
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HXF020-03/08 |
600/24" x
600/24"
x 600/24" |
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HXF060-03 |
800 /32"x
600/24" x 1200/47" |
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HXF200-08 |
1135/45"
x 1300/51" x 1275/50" |
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HXF200-08 |
900/35" x
900/35"
x 2200/87" |
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HXF350-03 |
860/34" x
1340/53" x 1520/60"
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Our dedicated engineers will always take the extra step
to work with clients for customized designs.
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Our commitment: Cost, Quality & Delivery
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